Localized metallic interfaces for dependable electrical bonding.
KM can place conductive metallic material at selected mechanical interfaces, creating a path to engineer bonding performance around contact, corrosion, installation, and substrate requirements.
01
Define the problem
Failure mechanism, operating environment, geometry, and required function.
02
Engineer the material
Material selection or formulation based on the properties the application needs.
03
Develop the KM process
Feedstock characteristics and deposition conditions developed as an integrated system.
04
Validate performance
Test the resulting surface against the requirements that matter to the application.
Application development
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